w w w. ie iwo r l d . co m Designing a system using extended temperature components is the most effective method to ensure reliable functionality in an extreme temperature range is met 1. Placement & layout A PCB with good placement & layout helps SBC or system reduce heat. 2. Thermal Simulation To develop a thermal design with thermal simulation and air flow design is a more effective way to ensure a reliable thermal solution. 3. Infrared Thermography Detects infrared energy emitted from an object, converts it in to a temperature, and displays an image of the temperature distribution. NEC TVS-G100EXD ► Test Process -40ºC ~ 85ºC Wide Temperature Product -20ºC ~ 60ºC Standard Prodct Pass About IEI-2017-V10 IEI Designs Process for Wide Temperature Products Model KINO-DALW2 NANO-ALW2 NANO-BTW2 WAFER-BTW2 iQ7-ALW2 iQ7-BTW2 ICE-BTW2-T10 Size 170mm x 170mm 115mm x 165mm 115mm x 165mm 146mm x 102mm 70mm x 70mm 70mm x 70mm 84mm x 55mm Memory 2 x DDR3L SO-DIMM slot Max. 8GB 1 x DDR3L SO-DIMM slot Max. 8GB 1 x DDR3L SO-DIMM slot Max. 8GB 2GB onboard (4GB optional) 4GB onboard (8GB optional) 2GB onboard (4GB optional) 2GB onboard (4GB optional) Display 1 x HDMI 1 x LVDS 1 x VGA 2 x HDMI 1 x LVDS 1 x iDP 1 x HDMI 1 x LVDS 1 x VGA 1 x iDP 1 x LVDS 1 x VGA 1 x DDI (DP/HDMI) 1 x eDP/LVDS 1 x DDI (DP/HDMI) 1 x LVDS 1 x DDI (DP/HDMI) 1 x eDP 1 x VGA I/O 4 x USB 3.0 4 x RS-232 2 x USB 2.0 2 x RS-232/422/485 1 x PS/2 KB/MS 4 x USB 3.0 4 x RS-232 2 x USB 2.0 2 x RS-232/422/485 1 x PS/2 KB/MS 3 x USB 2.0 3 x RS-232 1 x USB 3.0 1 x RS-422/485 1 x PS/2 KB/MS 6 x USB 2.0 3 x RS-232 1 x USB 3.0 1 x RS-422/485 1 x PS/2 KB/MS 6 x USB 2.0 1 x USB 3.0 6 x USB 2.0 1 x USB 3.0 4 x USB 2.0 1 x USB 3.0 Storage 1 x microSD 2 x SATA 6Gb/s 2 x SATA 6Gb/s 1 x microSD 2 x SATA 3Gb/s 1 x microSD 1 x mSATA 2 x SATA 3Gb/s 1 x 8GB eMMC 5.0 (optional) 2 x SATA 6Gb/s 1 x 4GB SSD (optional) 2 x SATA 3Gb/s 1 x 4GB SSD (optional) 2 x SATA 3Gb/s Expansion 1 x M.2 (B Key) 1 x PCIe Mini 1 x PCIe x1 1 x M.2 (B Key) 1 x PCIe Mini 1 x PCI/104 1 x PCIe Mini 2 x PCIe Mini 4 x PCIe x1 3 x PCIe x1 3 x PCIe x1 KINO-DALW2 NANO-ALW2 NANO-BTW2 WAFER-BTW2 iQ7-BTW2 iQ7-ALW2 ICE-BTW2-T10 IEI Extreme Environment Series Selection Guide To meet -40°C~ 85°C, the critical components must have the best reliability. IEI reviews critical components, such as CPU, chipset, SD-RAM, Ethernet IC, clock generator, super IO, EC, PWM IC, transceiver, switch, bridge, hubs, etc.  Component specification review  Thermal solution design It ensures the system‘s reliability under extreme operating environments. Testing criteria: 1. Wide temperature cycle chamber 2. Operating temperature: -40ºC ~ 85ºC 3. Passmark® burn-in test at 100% loading and power on-off test  Wide temperature testing before shipment